20 beste Stellen als lead principal technical engineer in münchen, by – aktuell auf Personalsuche

Lead Principal Engineer Package Concept Engineering (m/w/div)
Infineon Technologies AG —München
- Vollzeit
- AutoCAD
- Montage
- Mit Reiseanteil
Lead Principal Engineer Digital Design (f/m/div)
Infineon Technologies AG —München
- Vollzeit
- Führungserfahrung
Lead Principal Engineer Formal Verification (f/m/div)
Infineon Technologies AG —München
- Vollzeit
- Künstliche Intelligenz
- Kommunikationsfähigkeit
Principal Engineer Product Data Management (f/m/div)
Infineon Technologies AG —München
- Vollzeit
Lead Principle Power SAE for Satcom/Telecom Application (f/m/div)
Infineon Technologies AG —München
- Vollzeit
- Mit Reiseanteil
- Elektrotechnik
High-Thrust Engine Chief Engineer (Technical Authority)
The Exploration Company —München
- Vollzeit
- Hybrides Arbeiten
- Master
- Führungserfahrung
- Umzugskostenzuschuss
Senior Principal Engineer Software Concepts Power-Aware Automotive Computing (f/m/div)
Infineon Technologies AG —München
- Vollzeit
- Doktorat
- Informatik
- Elektrotechnik
Principal Engineer IO Design
Infineon Technologies AG —München
- Vollzeit
- Elektrotechnik
- Führungserfahrung
- Kommunikationsfähigkeit
Principal Security Engineer
Vay —München
- Softwareentwicklung
Direkt bewerben
7 Tage
Turbopump Principal Engineer
The Exploration Company —München
- Vollzeit
- Forschungserfahrung
- Master
- Produktion
- Umzugskostenzuschuss
Principal Engineer, Application Engineering (f/m/d)
Renesas Electronics —München
- Vollzeit
- Informatik
- Master
- Bachelor
Principal of Information Security (f/m/d)
Orbem —München
- 120.000 € – 135.000 € pro Jahr
- Vollzeit
- Hybrides Arbeiten
- Künstliche Intelligenz
- Führungserfahrung
- Homeoffice-Möglichkeit
- Flexible Arbeitszeiten
Direkt bewerben
Senior / Principal Dimensioning Engineer – power train, transmission systems (m/f/d)
ABB —Gilching
- Vollzeit
- CAD
- Englisch
- Master
7 Tage
Principal Solution Consultant
Guidewire Software —München
- Vollzeit
- Vertrieb
- Mit Reiseanteil
- Künstliche Intelligenz
Senior Principal System Software Architect (embedded systems/ software-defined vehicle) (f/m/div)
Infineon Technologies AG —München
- Vollzeit
- DevOps
- Agile
- Elektrotechnik
Principal RF Engineer
Spire Global —München
- Doktorat
- Master
- C++
- Employee Assistance Program
- Mitgliedschaft im Fitnessstudio
CTPM Principal (m/f/d) – Germany (Ingolstadt/ Unterschleissheim)
Qualcomm —München
- Doktorat
- Informatik
- Java
Engineer – Product Quality Failure Investigation & Testing Quality Division (m/f/d)
LivaNova —München
- Vollzeit
- Schemata
- Master
- Bachelor
Chief Information Security Officer (f/m/d)
Orbem —München
- 120.000 € – 135.000 € pro Jahr
- Vollzeit
- Hybrides Arbeiten
- Künstliche Intelligenz
- Führungserfahrung
- Homeoffice-Möglichkeit
- Flexible Arbeitszeiten
Direkt bewerben
Principal RF Engineer
Spire —München
- Doktorat
- Master
- C++
- Employee Assistance Program
- Mitgliedschaft im Fitnessstudio

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Lead Principal Engineer Package Concept Engineering (m/w/div)

Infineon Technologies AG -
München

Jetzt bewerben

Details zur Stelle

Festanstellung | Vollzeit

Qualifikationen

AutoCAD
Montage

Vollständige Stellenbeschreibung

#WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks?As a Lead Principal Engineer Package Concept Engineering (m/w/div) on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your Role

Key responsibilities in your new role

Develop package concepts for IBC (Intermediate Bus Converter) modules targeting high efficiency and power density for hyperscale datacenters and AI servers
Evaluate and validate packaging / module concepts through simulation and hardware demonstrators, working closely with Backend Development, Product Development and System Architects
Initiate new ideas, concepts in collaboration with internal and external partners
Trigger Package / Module Projects with development partners at inhouse or OSAT manufacturing sites. Support and follow up on development projects through to final product release
Define a Packaging Roadmap for IBC Modules and derive the necessary innovation and pre-development activities, to assume right-fit capabilities for future needs
Provide consultation to customers on packaging-specific questions and continuously conduct market and competitor analyses to identify new business opportunities and understanding cost positioning

Your Profile

Qualifications and skills to help you succeed

With your strong communication skills and solution-oriented thinking, you successfully drive innovation and execution as part of an interdisciplinary global team
A technical background through a degree in e.g. Mechanical, Electronics or Physics
Extensive practical experience in assembly technologies with detailed knowledge of Back-End and/or EMS processes and materials
Deep understanding of concept & application dependencies influencing laminate design, materials and processes, to assess HW and Thermal Management aspects
Ideally with background knowledge of SMT related technologies
Experience with typical package design tools (e.g. AutoCAD/ Cadence)
Proven ability to solve problems with higher complexity by pro-actively involving expert networks
Occasional willingness to travel to customers and vendors with good communication and presentation skills in English and German

Contact:
Nicola Weihofer Senior Specialist Recruiting

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.

Jetzt bewerben

Erweiterte Suche

lead principal technical engineer Jobs in münchen, by

Lead Principal Engineer Package Concept Engineering (m/w/div)

Lead Principal Engineer Digital Design (f/m/div)

Lead Principal Engineer Formal Verification (f/m/div)

Principal Engineer Product Data Management (f/m/div)

Lead Principle Power SAE for Satcom/Telecom Application (f/m/div)

High-Thrust Engine Chief Engineer (Technical Authority)

Senior Principal Engineer Software Concepts Power-Aware Automotive Computing (f/m/div)

Principal Engineer IO Design

Principal Security Engineer

Turbopump Principal Engineer

Principal Engineer, Application Engineering (f/m/d)

Principal of Information Security (f/m/d)

Senior / Principal Dimensioning Engineer – power train, transmission systems (m/f/d)

Principal Solution Consultant

Senior Principal System Software Architect (embedded systems/ software-defined vehicle) (f/m/div)

Principal RF Engineer

CTPM Principal (m/f/d) – Germany (Ingolstadt/ Unterschleissheim)

Engineer – Product Quality Failure Investigation & Testing Quality Division (m/f/d)

Chief Information Security Officer (f/m/d)

Principal RF Engineer

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