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RF/mmWave IC & SiP Design Manager

Keysight Technologies, Inc. -
Böblingen

Jetzt bewerben

Details zur Stelle

Vollzeit
vor 3 Tagen

Qualifikationen

Fertigung
Doktorat
5G
Elektrotechnik
Master
Bachelor
Produktentwicklung
Elektrotechnik
Führungserfahrung

Vollständige Stellenbeschreibung

Overview:

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

About the Team

The Keysight Labs MMIC and SiP Design team in Böblingen develops advanced microwave and mmWave integrated circuits and System-in-Package (SiP) technologies supporting next-generation applications in AI, 5G/6G, automotive, and high-performance communications.

The team collaborates closely with Keysight Centers of Excellence, product divisions, and cross-functional R&D organizations to create innovative RF/mmWave technologies that shape future test and measurement solutions.

This is a highly visible engineering leadership role with strong influence on future product architectures, technology strategy, and innovation roadmaps.

About the Role

We are seeking an experienced RF/mmWave IC & SiP Design Manager to lead a high-performing engineering team focused on the development of advanced RF and mmWave semiconductor and packaging solutions.

In this role, you will drive technical execution, team leadership, and strategic R&D initiatives across multiple technology platforms including InP, GaAs, GaN, and SiGe. You will partner closely with Technical Project Managers, product organizations, and external technology partners to deliver high-impact innovations from concept through production.

This role is ideal for a leader who combines deep technical understanding of RF/mmWave technologies with strong people leadership, project execution, and strategic thinking.

Responsibilities:

Lead and develop a high-performing team of MMIC and SiP engineers working across multiple semiconductor technologies and packaging platforms
Drive the design and development of advanced RF/mmWave products aligned with evolving AI, 5G/6G, automotive, and communication market needs
Collaborate with Technical Project Managers to define project scope, timelines, deliverables, budgets, and resource planning
Support the development of next-generation device modeling and validation infrastructures for emerging process technologies
Optimize trade-offs between performance, cost, manufacturability, schedule, and scalability
Improve engineering workflows, methodologies, and design tools to accelerate development efficiency and time-to-market
Contribute to long-term technical strategy, innovation roadmaps, and future product architecture planning
Partner closely with internal product groups, fabrication partners, and packaging vendors to support successful product development and production transition
Mentor and support the technical and professional growth of engineering team members
Communicate project status, technical isks, and strategic recommendations to internal stakeholders and leadership teams

Qualifications:

Required Qualifications

Bachelor’s or Master’s degree in Electrical Engineering or a related field
Strong experience in RF/mmWave circuit design and related semiconductor packaging technologies
Experience leading complex engineering or R&D projects from concept through production release
Demonstrated leadership experience managing or mentoring technical engineering teams
Strong understanding of MMIC technologies such as GaAs, GaN, InP, or SiGe
Experience managing technical deliverables, project timelines, and budgets
Excellent communication and stakeholder management skills within cross-functional engineering environments

Desired Qualifications

PhD in Electrical Engineering or related discipline
Experience with System-in-Package (SiP) integration and advanced packaging technologies
Experience working with semiconductor fabrication houses and external assembly partners
Familiarity with device modeling, validation infrastructures, and RF measurement methodologies
Experience supporting high-frequency product development for AI, telecom, aerospace, or automotive applications
Exposure to strategic technology planning and product platform development

Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***

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