1. Education: Bachelor’s or Master’s degree in Mechanical, Electrical, or Materials Engineering, Physics, Quality/Reliability, or a related science/engineering field.
2. Experience: 0 to 3 years of hands-on professional experience within semiconductor manufacturing, quality and reliability engineering, process integration, yield, or packaging/bumping/assembly.
3. Technical Knowledge: Initial experience with defect density inspection tools, recipe creation, failure analysis methods, or statistical process control (SPC).
4. Languages: Fluent in written and spoken English.
5. Personal Attributes: Highly motivated with strong ownership, resilience under pressure, and a proactive, collaborative approach to solving complex problems.
1. Familiarity with big data analysis software, scripting languages, or statistical tools (e.g., JMP, SQL, or Python).
2. Basic conversational communication skills in German and/or Mandarin.
1. Help build a completely new semiconductor manufacturing site in Europe.
2. Work in a highly international environment with colleagues across Europe, Taiwan and the US.
3. Shape processes instead of maintaining existing structures.
4. Participate in global projects and cross-functional collaboration.
5. International onboarding including approximately 9-12 months of training in Taiwan.
