Scantinel is a world-leading FMCW LiDAR start-up company, headquartered in Ulm, Baden-Württemberg, Germany. Incubated in the global optics leader Carl Zeiss AG in 2016, Scantinel spun off as an independent company in 2019 backed by ZEISS Ventures, Scania Growth Capital and PhotonDelta. In January 2026, Scantinel became a subsidiary of MicroVision, Inc.
We are building best-in-class FMCW LiDAR technology for future mobility applications. FMCW LiDAR systems will help create unparalleled safety level in automotive, mobility, trucking, and for industrial application.
- Create the photonic packaging concept for advanced integrated optical sensors
-
Define and implement wafer level hybrid integration processes for optoelectronic components in Photonic packages
-
Define and implement chip and module packaging specifications
-
Develop assembly processes for high precision optical components
-
Test and qualify of the packaged components
-
Select strategic partners and sub-contractors for wafer level, chip and module packaging
- A Master or PhD in engineering or fundamental science
-
A few years of experience in photonic packaging, photonic integration and integrated optics
-
Expert knowledge of photonic packaging processes as well as industry insights to photonic packaging houses
-
Experience in cooperation with external partners
-
Willingness of working in fast-moving environments with high levels of ambiguity and rapidly changing markets as well as a ‘hands-on-attitude’
-
Fluent in English, German is a plus
